The thermal shock chamber (TSC) is a cornerstone instrument in environmental-reliability testing. By exposing a specimen to rapid alternations between extremely high and extremely low temperatures, it reproduces the severe thermal excursions encountered during service or transport.

Frost formation in a thermal shock test chamber is a sublimation phenomenon where moisture inside the chamber condenses under low-temperature conditions. But why does this happen? Is it simply because the chamber temperature is too low?

Providing a stable and continuous voltage to the constant temperature and humidity test chamber is essential for ensuring its proper operation. To achieve a stable current supply, the device's power must be correctly connected to the circuit. So, how is this done?

The high and low temperature test chamber is a large, high-precision testing instrument.

Most temperature cycling test chambers on the market feature an inner chamber made of stainless steel. However, after prolonged use, rust may still appear on the equipment. Why does this happen, and are there effective ways to prevent it?